TEL MEMS Project offers unique manufacturing and test equipment for the fabrication of MEMS devices. This ability to create these innovative solutions is made possible through TEL's extensive experience in the Semiconductor market.

TEL can also provide process and prototyping services to customers who would like to design and develop MEMS devices using an in-house 6" MEMS fabrication line.

MEMS stands for Micro Electro-Mechanical Systems and is sometimes referred to as "Micro-machine" in Japan or MST (Micro System Technology) in Europe. MEMS devices are typically manufactured using a silicon fabrication process similar to those used for standard electronic semiconductor devices.

The micro-mechanical structure of a MEMS device is processed at a micron to sub-millimeter scale on Silicon substrate and is then used in sensor, actuator, or other applications. Today this technology is being considered for use in super high density 3-dimensional packaging techniques such as CoC (Chip on Chip) or WoW (Wafer on Wafer).