TEMEON is a system designed to test and evaluate both the electrical and previously untested mechanical characteristics of MEMS devices at the wafer level by applying a unique local vibration stimulus input. In addition, TEMEON makes use of an ultra low force and low Cres contact technology that enables much more accurate measurement of the dynamic characteristics of these sensitive MEMS devices. The TEMEON functionality can be realized with commercially available wafer probers.

• Local vibration stimulus input technique
• Ultra low force contact / Low Cres contact technology
• Wafer handling/chuck technology (Wafer with through hole)

• *TEMEON is a trademark of Tokyo Electron Limited